Session Chairs: Qinghuang Lin, Canon Nanotechnologies, Inc. (United States) and John Robinson, KLA Corporation (United States)

8:00 AM - 8:20 AM:
Welcome and Opening Remarks

8:20 AM - 9:00 AM:
Riding the wave of AI with semiconductor technology innovations

Michael Wu TSMC (Taiwan)

The rapid evolution of generative artificial intelligence has attracted unprecedented global attention and is changing the future of the workplace and the development of the industry. The effective use of generative artificial intelligence has also become an indispensable competitive advantage for enterprises in digital empowerment. Continuous innovation and breakthroughs in semiconductor technology are undoubtedly one of the important enablers of the development of artificial intelligence.
The exponential growth of chip computing power is the best manifestation and contribution of the continued progressof semiconductor technology scaling. In the next five to ten years, the application of artificial intelligence will become a new growth driver for the semiconductor industry. The symbiotic relationship between artificial intelligence and semiconductor technology will further bring unparalleled maximum synergy to the development of society.
In this paper, we will review the evolution of artificial intelligence and the advancement in CMOS technology. In addition, examples of machine learning assisted technology development will be illustrated. Looking forward, the anticipated process technology challenges and opportunities will also be discussed.

Dr. Michael Wu is Vice President of Platform Technology Development under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is currently responsible for advanced platform technology development and is also in charge of TSMC’s Technology Development Effectiveness Office. Dr. Wu joined TSMC R&D in 1996 and has since participated in advanced CMOS technology development from 0.13um, 90nm, 65nm to 28nm, and contributed greatly to successful development of 16nm, 7nm and 3nm technologies.
Dr. Wu has received multiple recognitions including the National Industrial Innovation Award – Innovative Trailblazer of the Year in 2013, the National Management Excellence Award in 2015, and the Chinese Outstanding Engineer Award in 2017.
Dr. Wu served in several positions in the Executive Committee of the International Electron Devices Meeting (IEDM) from 2013 to 2016 and was Technical Program Chair and General Chair of VLSI-TSA in 2017 and 2018, respectively.
Dr. Wu was inducted as a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) for his leadership in CMOS process integration. He has published 50 papers and holds a total of 72 patents in the field of semiconductor technology.
Dr. Wu received his M.S. degree and Ph.D. in Electrical Engineering from University of Wisconsin-Madison. He also received an EMBA degree in the Institute of Technology Management from National Tsing Hua University.

9:00 AM - 9:40 AM:

Christophe Fouquet ASML Netherlands B.V. (Netherlands)

Abstract to be announced

Christophe Fouquet is President & CEO of ASML. A French national, he joined ASML in 2008. He was appointed to the Board of Management in 2018 as Chief Business Officer and appointed President & Chief Executive Officer in 2024.
Christophe holds a Masters’ degree in physics from the Institut Polytechnique de Grenoble and has more than 25 years’ experience in the semiconductor industry.
He is a firm believer in putting the customer at the center of everything that ASML does, and in empowering its global team of more than 42,000 people to take ownership and to always ask: What’s next?

Event Details

FORMAT: General session with live audience Q&A to follow each presentation.
MENU: Coffee, decaf, and tea will be available outside presentation room.
SETUP: Theater style seating.