23 - 27 February 2025
San Jose, California, US

SPIE Advanced Lithography + Patterning application tracks

Five interdisciplinary topical areas: AI/ML, Sustainability, Stochastics, Holistic Patterning, and EPE/Overlay

What is an application track?

An application track is a grouping of presentations on a topic of widespread interest across different conferences. During abstract submission, the submitting author should select an application track if it is relevant to their research. When the program is published online, presentations within each application track can be filtered so they display together in a single view.

Attendees gather to hear specific topical research found in the application track listing online

What are the benefits of application tracks?

Application tracks enable attendees to group and explore presentations in the conference programs to more easily plan their event schedule around the topic of interest. Application track filters span across all conferences at an SPIE event. The ability to group presentations together across the entire event in this way helps participants more easily locate a presentation in their area of interest and has the reciprocal benefit of helping authors' presentations be more easily found.

Review the presentations found within each application track for this meeting by clicking on the links below.

Five applications tracks to explore


Papers that highlight the use of artificial intelligence, machine learning, and deep learning to create and implement intelligent systems across multiple sectors, technologies, and applications.


Papers that highlight the use of optics and photonics for renewable energy, natural resource management, sustainable and green manufacturing, and greenhouse gas mitigation in support of the UN Sustainable Development Goals.


Papers related to Line Edge Roughness (LER), Line Width Roughness (LWR), photon and secondary electron stochastics, chemical and process nonuniformity.

Holistic Patterning

Papers related to holistic approaches to a total patterning solution from circuit layout, source, mask, illumination, film stack, material selection, and process co-optimization.


Papers related to overlay, CD, and Edge Placement Error (EPE); characterization and metrology, root cause analysis, and process improvements.