Guangzhou Xianyi Electronic Technology Co., Ltd., main products are divided into three business segments: microelectronic packaging interconnection materials, microelectronic packaging interconnection components, and third-generation power semiconductor silicon carbide IC carrier boards (AMB). The company's products have achieved secure supply of key basic materials and full autonomy and controllability in multiple fields such as laser, optical communication, microwave infrared, power electronics, automotive electronics, consumer electronics, 5G Internet of Things, etc., providing escort for customer development. It is a leader in high-reliability microelectronic packaging interconnection materials in China.
Xianyi Electronic has been recognized as a national high-tech enterprise since 2014, a Guangzhou enterprise research and development institution in 2016, a "specialized, specialized, special, new" small and medium-sized enterprise in Guangdong Province in 2020, a national "small giant" in 2021, and a top 100 inventor in the high-value patent cultivation and layout competition in the Guangdong-Hong Kong-Macao Greater Bay Area in 2021. In 2022, it won the Excellent Award of the National Competition of the 11th China Innovation and Entrepreneurship Competition, the First Prize of the Growth Group of Guangdong Division, the First Prize of the Growth Group of Guangzhou Division, and the champion of the 2022 Blue and Green Competition. In 2023, it was recognized as the Guangdong Semiconductor Micro-connection Packaging Materials Engineering Technology Research Center.
Xianyi Electronic has a strong professional R&D team, and has established R&D centers, physical and chemical testing centers, precision mold engineering centers, and microelectronic material engineering centers. It adheres to independent research and development, and has long-term cooperation with professional institutions and research institutes. It has established partnerships with many universities such as Huazhong University of Science and Technology, Guangdong University of Technology, and Chongqing University of Technology.
The company independently masters core technologies, has obtained many authorized inventions, and has registered more than 30 trademarks at home and abroad to fully protect product intellectual property rights. It has passed ISO9001 quality management, ISO14001 environmental management, IATF16949 automotive quality management and GB/T29490 intellectual property management four system certifications, and introduced the Kingdee Cloud Star EBC management system to ensure high-quality products. At the same time, with advanced technology, reliable product quality and perfect supporting services, the company has achieved a turnover growth rate of over 40% for three consecutive years, ranking first in the high-end electronic packaging interconnection materials and precious metal soldering sheet segments.
The company's products are applied in many fields such as laser, optical communication, microwave infrared, power electronics, automotive electronics, consumer electronics, 5G Internet of Things, etc. The company's customers are leading enterprises in various fields, with more than 1,000 long-term cooperative customers. The company's products are fully autonomous and controllable, and have a good reputation and excellent reputation in the industry. It is an excellent core supplier relied on by customers, providing high-quality strategic guarantees for customers' needs and development.
In the future, we aim to becoming the integrated service provider of microelectronic packaging and semiconductor devices based on key materials. As a foresighted, Xianyi Electronic proactive enterprise which keep moving.
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