Ultrashort pulsed laser direct-write technology for rapid prototyping of MEMS devices

Microelectromechanical Systems (MEMS) devices, known for their broad applications, are typically fabricated using lithographic processes that necessitate the use of masks. While effective, these traditional methods pose significant barriers to rapid design and prototyping, particularly when exploring and optimizing new technologies. To overcome these limitations, we propose an innovative approach using laser-enabled direct-write technology for the creation of MEMS devices. Unlike electron or ion beam direct-write methods, which offer high precision and resolution but can be time-consuming and costly, our approach leverages ultrashort pulsed lasers to achieve both subtractive and additive manufacturing processes. This technique allows for the creation and modification of micron and submicron features with high repeatability. We have successfully developed protocols for fabricating intricate features such as holes, demonstrating the versatility and precision of our method. A key enhancement in our process is the incorporation of gas processing both during and between laser cycles. This strategy significantly improves the quality of the fabricated features by controlling and removing material redeposition, which is often a challenge in laser processing. The gas-assisted approach ensures cleaner edges and more defined structures, thereby enhancing the overall quality and performance of the MEMS devices. Our direct-write technology presents a rapid, flexible, and cost-effective alternative for MEMS fabrication, ideal for both prototyping and production. This method not only accelerates the development cycle but also opens new possibilities for MEMS applications by enabling the creation of complex and high-precision structures without the constraints of traditional lithographic techniques.