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25 - 30 January 2025
San Francisco, California, US
Conference 13351 > Paper 13351-58
Paper 13351-58

Laser printing and laser sintering as a digital approach for the fabrication of micro-conductive patterns on flexible substrates

30 January 2025 • 1:20 PM - 1:40 PM PST | Moscone South, Room 214 (Level 2)

Abstract

The advanced requirements of flexible and large-area electronics demand low-temperature, solvent-free and mask-less processing of patterns with versatile form factors. Laser-induced forward transfer of metal nanoparticle inks, followed by laser sintering, is a key technology for flexible electronics. However, challenges remain for flexible, thermally sensitive substrates. We explore laser printing and processing of Ag nanoparticle inks on sensitive substrates and non-planar structures. Key parameters such as laser repetition rate and pulse overlap are investigated. Electrical behaviour and morphological characteristics of the fabricated structures are suitable for organic photovoltaics and thin film transistors.

Presenter

Kostas Andritsos
National Technical Univ. of Athens (Greece)
Kostas Andritsos is a PhD candidate in the physics department of NTUA. He received his diploma in School of Applied Mathematical and Physical Science, Physics Department from the National Technical University of Athens in 2018. He has been working as a junior researcher within the framework of EC and national-funded projects. His research focuses on the printing of materials in the liquid phase for microelectronics applications and functional devices in the flexible state, as well as on the printing of novel 2D materials.
Application tracks: 3D Printing , Sustainability
Presenter/Author
Kostas Andritsos
National Technical Univ. of Athens (Greece)
Author
Cyprus Univ. of Technology (Cyprus)
Author
National Technical Univ. of Athens (Greece)
Author
Cyprus Univ. of Technology (Cyprus)
Author
Cyprus Univ. of Technology (Cyprus)
Author
Filimon Zacharatos
National Technical Univ. of Athens (Greece)
Author
FlexEnable Technology Ltd. (United Kingdom)
Author
FlexEnable Technology Ltd. (United Kingdom)
Author
Cyprus Univ. of Technology (Cyprus)
Author
National Technical Univ. of Athens (Greece)