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25 - 30 January 2025
San Francisco, California, US
Conference 13369 > Paper 13369-26
Paper 13369-26

Integrated photonic ultrasound transducers for medical imaging

28 January 2025 • 4:50 PM - 5:10 PM PST | Moscone South, Room 307 (Level 3)

Abstract

We present our experimental results on ultrasound transducers based on Photonic Integrated Circuits. We have fabricated and tested devices based on Mach Zehnder Interferometers and Ring Resonators, in the thick-Silicon on Insulator platform (VTT, Finland) and Si3N4 platform (Ligentec, Switzerland). We have obtained a Noise Equivalent Pressure which is two orders of magnitude lower than conventional State-Of-The-Art transducers, clearly demonstrating the huge potential of this concept.

Presenter

Peter J. Harmsma
TNO (Netherlands)
Peter Harmsma studied Applied Physics at the University of Twente (NL), and obtained his PhD in 2000 at the Delft University of Technology (NL) on InP-based photonic integrated circuits. Following his PhD, he was one of the founders of III-V Photonics. In 2008 he joined TNO as a scientist in integrated nano-photonics, focusing mainly on sensor applications. These applications often require a multidisciplinary approach and a system level architecture to be successful. In his work on evanescent-field biosensors, Peter developed not only advanced photonic sensors, but also the cost-effective read-out system and algorithms which are the foundation of a contemporary life science instrument. His current work on opto-acoustics strongly relies on cooperation with acoustic experts. Peter has worked in the main integrated photonics material platforms (SOI / SiN / InP / polymer), holds several patents, and is currently active in EU-funded projects MedIPUT and Photon Hub Europe.
Application tracks: Photonic Chips
Presenter/Author
Peter J. Harmsma
TNO (Netherlands)
Author
Maurits S. van der Heiden
TNO (Netherlands)
Author
TNO (Netherlands)
Author
TNO (Netherlands)
Author
Sabiju Valiya Valappil
Technische Univ. Delft (Netherlands)
Author
TNO (Netherlands)
Author
Mikko Harjanne
VTT Technical Research Ctr. of Finland Ltd. (Finland)
Author
VTT Technical Research Ctr. of Finland Ltd. (Finland)
Author
Sami Ylinen
VTT Technical Research Ctr. of Finland Ltd. (Finland)
Author
Yisbel Marin
VTT Technical Research Ctr. of Finland Ltd. (Finland)
Author
Päivi Heimala
VTT Technical Research Ctr. of Finland Ltd. (Finland)
Author
Ligentec SA (Switzerland)
Author
Andreas Frigg
Ligentec SA (Switzerland)
Author
Paul van Neer
TNO (Netherlands)