Paper 13344-25
Paper 13344-25
High power diode laser development using advanced bonding technology and innovative structure design
28 January 2025 • 2:30 PM - 2:50 PM PST | Moscone South, Room 206 (Level 2)
Abstract
High power diode lasers, operating in long pulse width mode, require high reliability in the medical aesthetic application. In this study, we have developed a sophisticated high-performance diode laser device. For diode laser (LD) chips with a 1.5 mm cavity length at a wavelength of 808 nm, the thermal resistance is approximately 0.3 K/W. The thermal rollover power in continuous mode reaches 268 W, which is 40% higher than conventional MCCs with direct chip bonding. In quasi-continuous mode with 20 ms at 10 Hz, the maximum power reaches 345 W, marking a 15% enhancement compared to MCCs with direct chip bonding.
Presenter
Focuslight Technologies Inc (China)
Chun is currently the Chief Scientist at Focuslight Technologies, Inc. He has formerly served roles as Director of Engineering, Principal Scientist, Engineering Manager, and Chief Engineer in optoelectronic and photonic companies. He has over 30 years research and product development experience in fiber laser, solid state lasers, semiconductor lasers, and fiber optic components.
He received his Ph.D. degree from Penn State University. He has published 85 peer-reviewed articles in professional journals, and over 40 invited talks in international and national symposiums and workshops. He holds 21 granted US patents an