Paper 13351-2
Paper 13351-2
Formation of through-glass vias (TGVs) in glass substrates using femtosecond laser operating in MHz/GHz burst mode
27 January 2025 • 9:15 AM - 9:35 AM PST | Moscone South, Room 214 (Level 2)
Abstract
The increasing demand for miniaturized and high-performance consumer electronics has driven advancements in packaging solutions, including the transition to glass interposers. A critical aspect of this development is the fabrication of high-density Through-Glass Vias (TGVs). This study presents the formation of TGVs in various glass substrates using a femtosecond laser FemtoLux 30 operating in MHz/GHz burst modes. By employing burst mode and micromachining methods such as bottom-up milling, TGVs with aspect ratios exceeding 1:80 were achieved, with drilling times as low as 350 ms. The findings demonstrate the potential of GHz burst femtosecond lasers as a high-throughput, precise solution for TGV fabrication.
Presenter
EKSPLA (Lithuania)
Deividas Andriukaitis is the Laser OEM Sales Manager at Ekspla. He holds a Bachelor's degree in Laser Engineering, with a thesis focused on the use of femtosecond lasers in hybrid manufacturing processes for lab-on-chip devices. and Master's degree in Laser Technology with thesis specializing in ceramics processing with femtosecond lasers in MHz/GHz burst mode. Deividas began his career at a workstation builder company, as a researcher, where he acquired extensive knowledge about the application of femtosecond lasers. In his current role at Ekspla, he works in femtosecond lasers sales, discovering new applications, engaging in sales discussions, attending conferences, and delivering presentations.