It took more than a decade for silicon photonics to become an established manufacturing platform for photonic integrated circuits. Close to 13 million optical transceivers based on silicon photonics will be shipped in 2024 and this number will reach 40 million in 2026. Higher reliability of optical modules manufactured using wafer scale approach is one of several factors contributing to accelerated adoption of this technology.
LightCounting estimates that new optical materials, including Thin Film Lithium Niobate (TFLN) and electro-optic (EO) polymers, will be also used for high-speed modulators by the end of this decade. Both technologies use silicon photonics as a platform for integration with other devices. Adding these materials to silicon photonics foundries will broaden the design space for optical interconnects and many other applications of optical devices.
The panel discussion will include experts from suppliers of silicon photonics, TFLN and EO polymers.
Moderator
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Vlad Kozlov
Chief Analyst
LightCounting (United States) |
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Panelists
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Yves LeMaitre
CEO
Lightwave Logic Inc. (United States) |
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Corrado Sciancalepore
Technical Marketing Manager
Photonics & Cloud AI Business Unit
SOITEC (France) |
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Guijun Ji
Senior Vice President of Strategy
Advanced Fiber Resources (China) |
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Brad Booth
CEO
NLM Photonics (United States) |
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Event Details
FORMAT: Panel discussion followed by audience Q&A.
MENU: Coffee, decaf, and tea will be available nearby.
SETUP: Theater style seating.
