Gel-Pak

HAYWARD, Calif., January 08, 2025 — Gel-Pak, a Delphon company and a worldwide leader in cutting-edge materials and protective carriers for photonic devices, today announced it will demonstrate its latest product breakthroughs for the photonics market at the Photonics West 2025 exhibit in San Francisco, January 28-30. Working in collaboration with key industry leaders, Gel-Pak has designed innovative new device carriers comprised of novel elastomer materials and form factors. These new products enhance manufacturing efficiency and yield by streamlining process steps and significantly reducing the risk of breakage for high-value devices during handling and transport. • The VMF carrier is ideal for handling fast axis collimating lenses. It holds components by their edges, minimizing contact with the active area of the optic’s surface. Because contact is limited to the non-critical sections of the device, costly cleaning steps can be avoided. • The VTX product is ideal for handling ultra-small lasers during automated assembly and has been shown to increase throughput by eliminating die migration issues. • The BTXF carrier is available in 2”, 4”, and JEDEC tray configurations. The carrier uses a micro texture to secure and protect fragile photonic devices. It also offers, a clean method of holding optical components by only touching 2% of the device’s surface, which significantly reduces residue. • A newly developed product designed for use in manufacturing and assembly of AR optics and lenses will be shown. The product holds devices by their edges and can be customized to accommodate a variety of shapes and sizes. Gel-Pak is known for unique solutions that enable handling, transport and processing of small, valuable devices without risk of damage. It has a long history of collaboration with the world’s leading photonic device manufacturers to create customized solutions for handling their sensitive components. The company first served the photonics market with its original Gel-Box products for handling optics and laser diodes. It next expanded into a proprietary vacuum release technology for use in mid and high-volume assembly of photonic devices. Today, Gel-Pak continues to leverage its strong track record of industry collaboration and materials expertise to develop the next generation of products for advanced technologies. "Our commitment to innovation and collaboration with industry leaders has enabled us to develop solutions that meet the evolving needs of the photonics market. We are excited to showcase our latest advancements at Photonics West 2025," said Joe Montano, President and CEO of Delphon About Gel-Pak Gel-Pak manufactures a family of polymer-based carriers and films designed to provide maximum protection during the shipping, handling and processing of delicate devices. Our manufacturing expertise allows us to customize existing products or rapidly develop novel solutions to meet evolving requirements for demanding environments. Headquartered in Hayward, CA the company has been manufacturing device carriers since 1980. For more information, visit our website at www.gelpak.com. About Delphon Delphon comprises a carefully curated portfolio of companies that develop and deliver highly engineered materials for critical environments. Our materials, manufacturing, engineering and business experts focus on acquiring and investing in companies that develop advanced polymer, adhesive and print-on-product technologies. Our companies support customers in industries that are transforming the world, such as the semiconductor, medical/pharmaceutical and electronics industries. Our portfolio currently includes Gel-Pak, UltraTape and TouchMark. To learn more about Delphon, visit our website at www.delphon.com. To learn more, please visit Gel-Pak at Booth #567 at Photonics West, taking place January 28th to January 30th or contact Jennifer Nunes, Sr. Director, Marketing, at jnunes@delphon.com or visit www.gelpak.com.