Simulation-based laser process development for industrial laser micromachining applications (Invited Paper)

In consumer electronics, semiconductor device manufacturing, and other industries that widely employ laser micromachining technologies, there is a continuous drive to achieve higher processing quality and throughput. The intricate dynamics of laser-material interaction, coupled with its non-linear behavior, pose significant challenges for rapid process development and optimization. To address these challenges, advanced multi-physical simulation has emerged as an indispensable tool for understanding and predicting the complex phenomena occurring during laser processing. These simulations provide insights into the coupled dynamics of heat transfer, phase changes, melt flow and laser-induced plasma plumes, offering a deeper understanding of the fundamental mechanisms governing the process. In this study, several key laser micromachining applications including laser via drilling for High-Density Interconnect (HDI) and the rapid formation of Through-Glass Vias (TGVs) are explored through a simulation-based approach that aims to enhance process efficiency and drive innovation in developing new process solutions.