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25 - 30 January 2025
San Francisco, California, US
Conference 13354 > Paper 13354-19
Paper 13354-19

Laser powder bed fusion process combined with infrared heating for reduced residual stress and support-free fabrication of parts

29 January 2025 • 9:20 AM - 9:35 AM PST | Moscone South, Room 201 (Level 2)

Abstract

Conventional laser-based powder bed fusion (PBF-LB/M) for fabricating 3D metal parts requires support structures to secure the printed parts to a baseplate. However, these support structures often decrease printing efficiency and limit design freedom. In this study, a novel method to substantially reduce the thermal residual stresses produced during the PBF process has been developed by combining focused in situ infrared (IR) heating with conventional techniques. The reduced stress enables the fabrication of high-aspect-ratio Ti-6Al-4V thin walls and zero-degree overhang beams, which cannot be printed using conventional processes. Furthermore, this method allows for support-free printing of various 3D parts, including a level two Menger sponge and a hollow honeycomb cylinder. In the novel process, the IR-heated powder, with loose consolidation, functions as both a support structure to withstand internal thermal stresses and external impacts and as a heat sink. The IR-consolidated powder can be easily removed from the printed part and reused.

Presenter

Dongsik Kim
Pohang Univ. of Science and Technology (Korea, Republic of)
Professor Dongsik Kim received his Ph. D. degree from UC Berkeley (USA) in 1998. After serving as an Assistant Professor at UT Austin (USA) for two years, he joined Pohang University of Science and Technology (POSTECH) in Republic of Korea and is currently a professor in the Mechanical Engineering Department. His main research interests lie in laser materials processing, with emphasis on metal 3D printing, surface cleaning/modification, and modeling and simulation of laser interaction with materials. He published numerous archival journal papers and won several awards, including the inaugural Kwangwon Award from KSLP and the Netzsch KSTP Thermophysical Properties Award.
Application tracks: 3D Printing
Author
Arif Hussain
Pohang Univ. of Science and Technology (Korea, Republic of)
Author
Junghoon Lee
Pohang Univ. of Science and Technology (Korea, Republic of)
Author
Seongi Hong
Pohang Univ. of Science and Technology (Kosovo, Republic of)
Author
Young Sam Kwon
CetaTech, Inc. (Korea, Republic of)
Presenter/Author
Dongsik Kim
Pohang Univ. of Science and Technology (Korea, Republic of)