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25 - 30 January 2025
San Francisco, California, US
Conference 13350 > Paper 13350-31
Paper 13350-31

Integrated ultra-high-speed vertical NAND FLASH VCSEL and high-power CMOS VCSEL for advanced silicon photonics applications

28 January 2025 • 6:00 PM - 8:00 PM PST | Moscone West, Room 2003 (Level 2)

Abstract

In recent years, Vertical NAND FLASH has replaced NOR FLASH in most of the handheld wireless digital markets, due to advantages of lower cost, higher packing density, and higher speed. However, the speed of NAND FLASH is still behind DRAM and SRAM used in computing tools, caused by the dielectric trapping, and tunneling processes, which result in longer WRITE and ERASE cycles. In this report, we will demonstrate an ultra-high-speed Photonic Vertical NAND FLASH with multiple VCSELs (Vertical Cavity Surface Emitting Laser), that may outperform DRAMs due to lower voltages and much faster nonvolatile memory operations. The new capability of integrated arrays of VCSELs with the high-speed Vertical Photonic NAND FLASH for lasing and nonvolatile data storage can be achieved.

Presenter

Northrop Grumman Corp. (United States)
James Pan is a senior principal engineer in Northrop Grumman Corporation (Linthicum, Maryland, USA). He used to work for Semicoa Corporation (Costa Mesa, California), Fairchild Semiconductor (West Jordan, Utah), IBM T. J. Watson Research Lab. (Yorktown Heights, New York), IBM Microelectronics (Fishkill, New York), Advanced Micro Devices (Sunnyvale, California), Atmel Corporation (Colorado Springs, Colorado), and Micron Technology (Boise, Idaho). He received a Ph.D. degree from Purdue University (West Lafayette, Indiana), MSEE from University of Texas at Austin, and BSEE from National Taiwan University. In 2009 he started American Enterprise and License Company (AELC). Dr. Pan holds more than 80 patents.
Application tracks: 3D Printing , Translational Research , Photonic Chips , AI/ML , Sustainability
Presenter/Author
Northrop Grumman Corp. (United States)