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25 - 30 January 2025
San Francisco, California, US
Conference 13369 > Paper 13369-2
Paper 13369-2

Heterogeneous integration-enabled energy-efficient optical communication and computing (Invited Paper)

27 January 2025 • 11:30 AM - 12:00 PM PST | Moscone South, Room 307 (Level 3)

Abstract

Energy efficiency is a major metric for both photonic devices and integrated photonic circuit (PIC) system. Compact device size and high integration density, two intrinsic merits of silicon photonics, don’t necessarily translate into high energy efficiency. In this talk, we will attempt to discuss how heterogeneous integration innovations from material, device physics and architecture perspectives are able to enable low power device and large-scale PIC operation for both optical commutations and computing applications.

Presenter

Hewlett Packard Enterprise Co. (United States), Univ. of Michigan (United States)
Di Liang is currently a Professor in Electrical Engineering and Computer Science Department at the University of Michigan, Ann Arbor. Prior that, he was a Director / Senior Staff Engineer in the Alibaba Group – US, and was a Distinguished Technologist at Hewlett Packard Labs in Hewlett Packard Enterprise where he led the advanced research of silicon and compound semiconductor integrated photonics for energy-efficient optical interconnect and high-performance computing. He received his Bachelor degree from the Zhejiang University, China, and Master and PhD degrees from the University of Notre Dame, US. He has (co)authored 1 edited book, 7 book chapters, nearly 300 journal and conference papers, and was granted by more than 60 patents with another 55+ pending. He is a Fellow of Optica, and editor of Light: Science and Applications (Nature Group), associate editor of Photonics Research (Optica) and Journal of Quantum Electronics (IEEE).
Application tracks: Photonic Chips , AI/ML , Sustainability
Presenter/Author
Hewlett Packard Enterprise Co. (United States), Univ. of Michigan (United States)
Author
Sudharsanan Srinivasan
Hewlett Packard Enterprise Co. (United States)
Author
Geza Kurczveil
Hewlett Packard Enterprise Co. (United States)
Author
Bassem Tossoun
Hewlett Packard Enterprise Co. (United States)
Author
Yingtao Hu
Hewlett Packard Enterprise Co. (United States)
Author
Hewlett Packard Enterprise Co. (United States)
Author
Hewlett Packard Enterprise Co. (United States)
Author
Hewlett Packard Enterprise Co. (United States)
Author
Hewlett Packard Enterprise Co. (United States)
Author
Hewlett Packard Enterprise Co. (United States)
Author
Hewlett Packard Enterprise Co. (United States)