Global microelectronics and laser industry trends and laser compression bonding (LCB) technology for the AI chip packaging

AI Heterogeneous Advanced Packaging Technologies have evolved quickly over the last several years and their package dimensions have increased to accommodate higher computing power and larger bandwidth. High-precision flip-chip bonding technology with minimum heat loading during the bonding process is required for these large-size packages. Minimum heat-loading is very important for heterogeneous chip packaging to minimize the impact of the thermal expansion coefficient difference between PCB substrate and chips or between glass interposer and PCB substrate. Thermal-compression bonding (TCB) technology is being tried with reasonable quality and throughput, but a long processing time for TCB becomes a bottleneck for increasing production capacity. To overcome technical issues, Laser Compression Bonding (LCB) technology and relevant assembly equipment are proposed and prepared. This LCB equipment can handle up to 100mm X 100mm size flip-chip and use the corresponding-size flat-top laser beam. The key ideas and some packaging examples using the LCB technology will be presented for large-size AI-grade advanced packages.