A study on laser induced graphene sensors with high strength and flexible properties using polyethylene packaging

Graphene induced from polyimide (PI) through laser processing exhibits high conductivity and mechanical properties, making it promising for flexible, high-strength sensors, particularly pressure sensors. Previous studies using PDMS for packaging faced limitations due to its high cost and low internal cohesion. This study uses polyethylene (PE) for packaging LIG sensors, offering similar tensile strength and more economical properties. A grid pattern is laser-etched onto PI, followed by thermal bonding with PE to produce a flexible LIG film. The film undergoes UV light processing, converting PI to graphene while minimizing PE impact. Molecular dynamics simulations confirmed graphene formation and reduced inter-flake spacing under specific conditions, enhancing understanding of LIG production and applications in flexible electronics.