Modern industrial machine vision relies heavily on new developments in image sensor technology. On one hand, availability of mature CIS manufacturing pushes the limits of Si-based devices in terms of form factor (multi-megapixel resolution), speed (multi-million frames per second) and sensitivity (long-tail absorption in UV and NIR). On the other hand, leveraging new materials and architectures allows for detection of spectral regions not accessible for silicon (such as short-wave infrared with quantum dots). Additionally, monolithic integration of optical structures (such as interference filters, metasurfaces or color splitters) lets us get information with significantly more details about the properties of objects under test than with conventional RGB arrays. In this talk, we will give an overview of new image sensor developments at imec, highlighting several world-firsts. The examples will include ultra-high-speed camera with 2,720,000 fps enabled by a customized imaging technology toolbox; hyperspectral cameras with wafer-level thin-film spectral filters fabricated directly on the pixels of the image sensor; and colloidal quantum dots monolithically integrated on readout circuits for SWIR-range sensitivity. We will also summarize imec’s design and product delivery capabilities, together with the portfolio of innovation services targeting efficient derisking and know-how transfers. 

Presenter

Pawel Malinowski Program Manager imec (Belgium)

 

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Event Details

FORMAT: Oral presentations followed by audience Q&A.
MENU: Coffee, decaf, and tea will be available nearby
SETUP: Theater style seating.