Engis Corp.

Booth: 4643 | View floor plan



Engis Corp.
105 W Hintz Rd
Wheeling, IL
United States
Website: www.engis.com

Company video


16 November 2023
Engis® Corporation’s Innovative Grinding Technology Proves Successful at Leading SiC Wafer Manufacturer
- State-of-the-art grinding system includes fully automated enhanced multi-spindle specially configured for coarse and fine grinding of SiC ingot and wafers up to 200mm. - Machine includes non-contact, in-situ thickness measurement techniques for targeted wafer thickness control. - Low capital, low operating expenditure solution for high precision wafering. Engis Corporation, a global leader in high-performance superabrasive lapping, grinding, honing, polishing products and related machinery & accessories announced today that a prominent US manufacturer of SiC wafers has completed the successful qualification of the Engis EAG Grinding System and will now purchase additional machines for their wafer production. Investing in the new single and dual spindle grinding system dramatically reduces initial capital expenditure and total cost of ownership. Combining the new tools with Engis grinding wheels enables you to achieve optimum performance in terms of wheel life and surface roughness. “We are committed to continuing our efforts to drive investment and production costs down with our grinding system and grinding wheels for SiC ingot and wafer production” commented Sean Gilmore, the President of Engis Corporation. Engis plans to make substantial further investments in Engis tools going forward.