MRSI Systems, Mycronic Group

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MRSI Systems, Mycronic Group
554 Clark Rd
Tewksbury, MA
United States
01876-1631
Website: www.mrsisystems.com

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Announcements

20 October 2023
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high force die bonder, a new variant of the proven MRSI-705 platform. The MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to 400°C from the top. It is the ideal tool for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging. Sintering is a heat-treatment process that gives greater strength, integrity, and conductivity to the bond and is considered the most reliable technology for connecting components in power electronics. Thermocompression bonding is a technique that uses high temperature and pressure to create strong and reliable interconnections between dies and substrates. The MRSI-705HF inherits the flexibility and robustness of the MRSI-705 platform, which can handle multiple die and process applications with auto-tool changing and laser soldering, eutectic with top and bottom heating, epoxy stamping, and dispensing in one machine. “We are proud to announce the new MRSI-705HF high force die bonder as part of our efforts to continuously innovate and help our customers meet the changing needs of the market. It will allow us to better serve customers in power devices and advanced packaging applications” said Dr. Irving Wang, Director of Marketing, MRSI Systems. For more information about MRSI Systems and the MRSI-705HF high force die bonder, please visit www.mrsisystems.com or contact sales.mrsi@mycronic.com.
20 October 2023
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
MRSI Systems, a part of Mycronic Group, a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, has been awarded the Silver Honoree for the Laser Focus World Innovators Award 2023 in the Manufacturing Equipment for Photonic Components category. The award recognizes the MRSI-S-HVM submicron die bonder, an advanced die bonder based on MRSI’s field-proven high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics that requires ultimate accuracy at the submicron level. The MRSI-S-HVM combines speed, flexibility, and precision for multiple die and process applications, such as wafer-level packaging for silicon photonics, chiplets, advanced sensors, co-packaged optics, and general 3D heterogeneous integration. Laser Focus World’s Innovators Awards program celebrates innovative technologies and products in the photonics market. Submissions were judged on originality; innovation; as well as impact on users and market. Also considered is the entry’s use of new technologies. Dr. Irving Wang, Director of Marketing, MRSI Systems, said, “We are honored to receive the Laser Focus World’s Annual Innovators Award again, which signifies that MRSI’s innovation capabilities continue to be recognized by industry experts. The trust placed upon us by customers and industry experts continues to inspire us to deliver cutting-edge innovations for the optoelectronics industry.” For more information about MRSI Systems and the MRSI-S-HVM submicron die bonder, please visit www.mrsisystems.com or contact sales.mrsi@mycronic.com.